Site Map

Search

PEER Internship Program for Undergraduates – Now Accepting Applications for Summer 2012

The Pacific Earthquake Engineering Research Center (PEER) is pleased to offer unique opportunities this summer for outstanding undergraduate students to participate in state-of-the-art research focused on the theme of Engineering Earthquake Resilient Communities. The 2012 program is made possible with funding from the National Science Foundation.

2010 PEER Interns Ariel Creagh and Cristian Acevedo pose with one of their damaged research specimens. These students were funded by NEES.

Recent earthquakes in the US and around the world have repeatedly shown that earthquake resilience is essential to building and sustaining urban communities. Earthquake resilience will play an increasingly important role in the professions associated with earthquake hazard mitigation. The ten-week 2012 PEER Summer Internship Program will introduce undergrad students to the concept of earthquake resilience and allow them to experience how many different engineering and social science disciplines interact to research the broad goal of earthquake resilient communities.

During the summer of 2012, interns will be hosted at UC Berkeley, UC Davis and University of Washington to conduct research projects in the fields of structural engineering, geotechnical engineering and risk analysis.

Each participant will receive a stipend of $7,000, intended to cover summer housing and travel expenses to the summer project location. PEER will provide additional compensation for travel to an Orientation Workshop at UC Berkeley and to the 2012 PEER Annual Meeting.

The first application deadline is Tuesday February 21, 2012 at 8:00 am Pacific Time. Application review will begin on February 21 and continue on a rolling basis until all internships are awarded. Applicants are strongly encouraged to apply before the February 21st deadline.

View a complete description of the program, the available intern research projects for the summer of 2012, the eligibility requirements, and application instructions.